For placing and removing ICs with 0.3" (7.62 mm MIC 03) and 0.6" (15.24 mm MIC 06) pin spacing.
These heatsinks have been specially developed for cooling ICs in a DIL housing. (Essential for more powerful ICs)
These heatsinks have been specially developed for cooling ICs in a DIL housing. (Essential for more powerful ICs)
Fischer Elektronik Heatsinks for ICS - Fischer Elektronik ICK 24 B, The Fischer Elektronik 19.4° Heatsink ICK 24 B for ICs has been specially developed for cooling ICs in a DIL housing 14-24 pins (essential for more powerful ICs). Fischer Elektronik...
Factory colour: Black; Heat sink features: with pre-drilled holes; Material: Aluminium; Material properties: anodised; Product size (height): 15 mm; Product size (length): 35 mm; Product size (width): 18.5 mm; Suitable for: SOT 32, TO 220; Thermal resistance...
Fischer Elektronik Heatsinks for ICS - Fischer Elektronik ICK 6/8 L, The Fischer Elektronik 83° Heatsink ICK 6/8 L for ICs has been specially developed for cooling ICs in a DIL housing 6-8 pins (essential for more powerful ICs). Fischer Elektronik ICK...
Fischer Elektronik ICK BGA Cool Body Heat Sinks - Fischer Elektronik ICK BGA 35 x 35, The Fischer Elektronik 16.5° Heat Sink has been specially developed for Pin Grid Arrays Heatsink measurements and the current BGA-Type. Labellable directly on the BGA-component....
Fischer Elektronik ICK BGA Cool Body Heat Sinks - Fischer Elektronik ICK BGA 40X40X10, The Fischer Elektronik 13.8° Heat Sink has been specially developed for Pin Grid Arrays Heatsink measurements and the current BGA-Type. Labellable directly on the...
Fischer Elektronik ICK PGA CPU Heat Sinks - Fischer Elektronik ICK PGA 21X21, The Fischer Elektronik 7° CPU Heatsink has been specially developed for IC design and PGA, and can be mounted with double sided, self-adhesive heat conductive film. Fischer...