Low design, reduced weight and effective heat conductivity.
Low design, reduced weight and effective heat conductivity.
Low design, reduced weight and effective heat conductivity.
For placing and removing ICs with 0.3" (7.62 mm MIC 03) and 0.6" (15.24 mm MIC 06) pin spacing.
For semiconductor clip installation.This text is machine translated.
Additional technical information: Base thickness: 4 mm; Factory colour: Black; Material: Aluminium; Material properties: anodised; Product size (height): 24 mm; Product size (length): 100 mm; Product size (width): 65 mm; Thermal resistance R(th): 2.5...
Material: Aluminium; Material properties: anodised; Product size (height): 20 mm; Product size (length): 51.5 mm; Product size (width): 51 mm; Thermal resistance R(th): 2.47 K/W
Material: Aluminium; Material properties: anodised; Product size (height): 37.5 mm; Product size (length): 51.5 mm; Product size (width): 51 mm; Thermal resistance R(th): 2.13 K/W
Factory colour: Black; Material: Aluminium; Material properties: anodised; Product size (height): 45 mm; Product size (length): 50 mm; Product size (width): 30 mm; Thermal resistance R(th): 4.2 K/W
Factory colour: Aluminium ; Material: Aluminium; Material properties: anodised; Product size (height): 10 mm; Product size (Ø): 70 mm; Thermal resistance R(th): 2.82 K/W