Kerafol U110 Thermally conductive pad silicone-free 1 mm 2.0 W/mK (L x W) 100 mm x 100 mm
Flexible ceramic, heat-conducting and insulating. U 110 is particularly suitable for silicone-sensitive applications and is an alternative to silicone-based Gap Pads (Softtherm Films). The silicone-free Gap Pads (Softtherm Films) offer a high electrical...
Kerafol U110 Thermally conductive pad silicone-free 2 mm 2.0 W/mK (L x W) 100 mm x 100 mm
Flexible ceramic, heat-conducting and insulating. U 110 is particularly suitable for silicone-sensitive applications and is an alternative to silicone-based Gap Pads (Softtherm Films). The silicone-free Gap Pads (Softtherm Films) offer a high electrical...
Kerafol U80 Thermally conductive tape silicone-free 0.15 mm 1.8 W/mK (L x W) 100 mm x 100 mm
If you are concerned about the use of silicone, we offer a ceramic-filled polyurethane film as an alternative material. Along with good thermal and excellent electrical properties, these films are characterized by an excellent perforation resistance....
Kerafol U80 Thermally conductive tape silicone-free 0.15 mm 1.8 W/mK (L x W) 190 mm x 190 mm
If you are concerned about the use of silicone, we offer a ceramic-filled polyurethane film as an alternative material. Along with good thermal and excellent electrical properties, these films are characterized by an excellent perforation resistance....
Kerafol U 90 Thermally conductive film silicone-free 0.2 mm 6 W/mK (L x W) 100 mm x 100 mm
Kerafol offers a ceramic-filled polyurethane film as alternative for situations in which silicon is unsuitable. Besides good thermal and electrical properties, these films are characterized by very good cut-through. The good physical properties are in...
Kerafol U 90 Thermally conductive film silicone-free 0.2 mm 6 W/mK (L x W) 190 mm x 190 mm
Kerafol offers a ceramic-filled polyurethane film as alternative for situations in which silicon is unsuitable. Besides good thermal and electrical properties, these films are characterized by very good cut-through. The good physical properties are in...