These heatsinks have been specially developed for cooling ICs in a DIL housing. (Essential for more powerful ICs)
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays Heatsink measurements suitable for the current BGA-Type. Labellable directly on the BGA-component.
Particularly suitable for Pin Grid Arrays